LD G200 Automatic BGA Rework Station | Lessdeal
LD G200 Automatic BGA Rework Station with optical alignment

LD G200 BGA Rework Station (Manual)

Ideal for all kinds of BGA repairing tasks. (CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF). With overheating guard and emergency start-stop function.

PRODUCT SPECIFICATION

Total Power 5300W
Top heater 1200W
lower heater 1200W
Bottom heater 2700W
Power Supply AC220V/AC110 (optional)
Positioning V-groove, PCB support
Temperature control K-type Sensor (Closed loop)
Temp accuracy ±2 degree
Workbench fine-tuning ±15mm forward/backward ±15mm right/left
Placement accuracy ±0.01mm
Camera magnification 10x-220x
PCB size Max 390x400mm Min 20x20mm
BGA chip size 2*2~80*80mm
Minimum chip spacing 0.15mm
Dimensions approx 610x570x750mm
Net weight Approx 60KG

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Features of the LD G200 BGA Rework Station

Deigned for ease of use:

  • It is embedded with an industrial grade PLC, a stepper motor drive and a smart temperature module which makes it very stable.
  • Windows OS interface in English & Chinese (USB) makes this machine easy to operate.
  • Comes with 5 different size of nozzles: upper 31*31mm, 38*38mm, 41*41mm.  Bottom 34*34mm, 55*55mm.
  • This soldering station has three heating zones, upper heater and lower heater are hot air, bottom is infrared preheat zone.
  • High power cross flow fan, cools the pcb very quickly, preventing it from deformation.
     

Accurate temperature control:

  • Three independent temperature heatings + PID self setting adjusted, temperature accuracy will be ±1°C.
  • This rework machine can set 8 segments heating, and has massive storage of groups temperature profile.
  • Allows setting BGA heating curve conveniently.
  • Automatic temperature curve analysis.
     

Convenient visual alignment:

  • Optical alignment + CCD color lens system.
  • Laser positioning for quick alignment.
  • Two color separation, magnification and micro adjustment.
  • Auto focus, auto correction, auto color differentiation.
  • Light level adjustment system.
  • Japanese made camera that can move front and back.
  • Built-in vacuum pump for picking up the bga chip.
     

State of the art components:

  • Precise fine-tuning of bga chip
  • X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 mm.
  • V-groove clamp + universal fixture suitable for all kinds of PCB.
  • Hot air nozzle with magnet, rotate in any angle, easy replace and operate.
  • Heating system and mount head 2 in 1 design, precise positioning.
     

Perfect security design:

  • Comes with fan failure protection and thermocouple failure protection function, overheating protection and emergency stop function.
  • Start up password and modify protection.
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