BGA Rework Station

Special features of the LD D1:-

• Linear slider moves in X, Y, Z axis all can micro adjust.
• HD drawer style touch screen interface and start up password for protection and modification.
• PLC control, PID parameters self setting adjustment and precise temperature module.
• Has three independent heating zones, upper heater (hot air), lower heater (hot air) and bottom (IR) preheating zone.
• K type close loop control
• The temperature accuracy will be on about 2 degree
• A vacuum tube helps pick up the bga chips conveniently after heating.
• Sound hint system: there is voice reminder 10s before the completion of heating.
• Security measure: overheat guard and emergency stop function.
• Upper heater can move up and down, front and back, rotate freely
• Strong sense of thermometer, temperature measurement more accurate
• PCB clamp (V-groove) with universal fixture, suitable for all kinds of BGA.
• With vacuum tube, help pick up the bga chip conveniently after heating.
• It can set 6-8 segments heating, and massive store temperature profile
• Cross flow cooling fan, fast cooling the pcb, prevent it from deformation.
• Hot air nozzle, rotate 360 degree, customized is available.
• CE certificate, with emergency stop and Automatic power-off protection device.

Applications:

• Complete range of rework applications in medium and large scale service centers.
• Mobile and radio systems devices repair
• Mobile phones, PDAs, handhelds, laptops, notebooks & motherboards repair
• LAN devices, network nodes and military communication equipment repair
• Portable medical equipment repair